TO headers (TO package headers) are precision metal packages used for mounting semiconductor devices, laser diodes, and sensor modules that require hermetic sealing.

The metal body is typically made of Kovar alloy, stainless steel, or copper alloy, providing excellent mechanical strength and thermal stability. Glass-to-metal sealing ensures a reliable hermetic structure, protecting components from moisture, dust, and environmental contamination.

Our TO headers are fully customizable, including the number of leads, dimensions, plating type, and packaging, to meet specific device requirements.

Technical Parameters

Custom Attributes

Product Features

• Hermetic Sealing: Reliable glass-to-metal sealing for extreme environments.
• High Mechanical Strength: Durable metal structure for long-term use.
• Excellent Thermal Stability: Performs well under temperature variations.
• Electrical Insulation: Prevents leakage and interference.
• Customizable Design: Pin configuration, size, plating, and packaging can be tailored.

Typical Applications

Packaging & Delivery

Customization Capability

Our R&D team can design and manufacture TO headers according to customer drawings and specifications. Customizable options include:

• Lead number and layout
• Dimensions and package size
• Plating type (gold, nickel, tin)
• Packaging solutions

Each custom order ensures reliability and meets the specific requirements of your devices.