• Huona (Shanghai) New Material Co., Ltd.
    Άλφρεντ...
    Λάβαμε τα αγαθά, όλα πήγαν καλά.
  • Huona (Shanghai) New Material Co., Ltd.
    Μαΐου.
    Η ποιότητα του προϊόντος είναι πολύ καλή, πέρα από τις προσδοκίες μου, η πραγματική χρήση της πλήρως ικανοποιεί τις ανάγκες μου, θα αγοράσουμε ξανά.
  • Huona (Shanghai) New Material Co., Ltd.
    Ματθαίος ***
    Αγόρασα κράμα χαμηλής διαστολής από την Τζόι, είναι μια πολύ υπεύθυνη κυρία, η ποιότητα των προϊόντων της Χουόνα είναι αρκετά καλή.
Υπεύθυνος Επικοινωνίας : Roy
Τηλεφωνικό νούμερο : +86 18930254719
Το WhatsApp : +8618930254719

0.05mm Diameter Silver-Plated Copper Wire With Anti-Oxidation & Corrosion-Proof For Precision Electronics

Τόπος καταγωγής Κίνα
Μάρκα HUONA
Πιστοποίηση ISO9001, RoHS
Αριθμό μοντέλου Καλυμμένο ασήμι καλώδιο χαλκού
Ποσότητα παραγγελίας min 10 κιλά
Τιμή Need to negotiate
Συσκευασία λεπτομέρειες Χαρτοκιβώτιο/ Ξύλινο
Χρόνος παράδοσης 10-25 εργάσιμες ημέρες
Όροι πληρωμής L/C,T/T,Western Union
Δυνατότητα προσφοράς 100 τόνοι/μήνα

Επικοινωνήστε μαζί μου για δωρεάν δείγματα και κουπόνια.

Το WhatsApp:0086 18588475571

Βυθός: 0086 18588475571

σκυϊδάκι: sales10@aixton.com

Αν έχετε οποιοδήποτε πρόβλημα, παρέχουμε 24ωρη ηλεκτρονική βοήθεια.

x
Λεπτομέρειες
Όνομα προϊόντος Καλυμμένο ασήμι καλώδιο χαλκού Υλικό επένδυσης Καθαρό ασήμι
Διάμετρος 0,05 mm (±0,003 mm) Δυνατότητα πώλησης 0,5–3,0μm
Επιμήκυνση ≥15% Αγώγιμο ≥105% IACS (20°C)
Θερμοκρασία λειτουργίας -60°C σε +200°C MOQ 10 κιλά
Επισημαίνω

Silver-Plated Copper Wire

,

0.05mm

,

High-Conductivity

Αφήστε ένα μήνυμα
Περιγραφή προϊόντων
Product Description
0.05mm High-Conductivity Silver-Plated Copper Wire
High-performance fine conductor for precision electronic components, featuring a high-purity oxygen-free copper core with uniform silver plating for superior electrical performance.
Product Overview
Silver-plated copper wire (0.05mm diameter) from Huona New Material is a high-performance fine conductor composed of a high-purity oxygen-free copper (OFC) core and a uniform, dense silver plating layer. Manufactured through precision drawing and continuous electroplating processes, this 0.10mm wire delivers excellent electrical conductivitysuperior oxidation resistance, and reliable solderability. With a diameter tolerance of ±0.003mm and plating thickness of 0.5-3.0μm, it is widely used in high-frequency signal transmission, miniaturized electronic components, and aerospace wiring applications.
Standard Designations & Core Material Foundation
  • Base Material: High-purity oxygen-free copper (OFC, ≥99.99%)
  • Plating Material: 99.9% pure silver
  • Key Specification: 0.05mm diameter (tolerance ±0.003mm)
  • Plating Thickness: 0.5-3.0μm (customizable)
  • Compliant Standards: ASTM B500, GB/T 4910, IEC 60884
  • Manufacturer: Huona New Material, certified to ISO 9001 and IATF 16949
Key Core Advantages
High Conductivity & Signal Integrity
  • Enhanced Conductivity: Silver's conductivity (63×10⁶ S/m) is higher than copper, reducing signal loss in high-frequency applications. The 0.10mm diameter balances conductivity and flexibility, making it ideal for high-speed data lines.
  • Low Contact Resistance: The silver plating ensures stable, low-resistance connections in connectors and switches, even after repeated mating cycles.
Excellent Oxidation & Corrosion Resistance
  • Silver Protective Layer: The dense silver coating prevents copper oxidation at high temperatures or in humid environments, maintaining long-term conductivity stability.
  • Corrosion Resistance: Resists sulfurization and most chemical corrosion, suitable for harsh environments such as aerospace and industrial control systems.
Good Mechanical Properties & Processability
  • Ductility & Flexibility: Elongation ≥15% (annealed) allows bending and winding on small mandrels (≥0.2mm) without breaking, suitable for fine-pitch components.
  • Uniform Plating: Advanced electroplating technology ensures a smooth, consistent silver layer with no peeling or blistering, even after drawing and annealing.
Technical Specifications
Attribute Value (Typical)
Base Material Oxygen-Free Copper (OFC)
Plating Material Pure Silver
Diameter 0.05mm (±0.003mm)
Plating Thickness 0.5-3.0μm
Tensile Strength 380-500 MPa (Hard Drawn); 220-300 MPa (Annealed)
Elongation ≥15%
Conductivity ≥105% IACS (20°C)
Operating Temperature -60°C to +200°C
Surface Finish Bright silver, smooth, oxide-free
Product Specifications
Item Specification
Supply Form Spools (100m/500m/1000m per spool)
Plating Type Soft silver plating (for soldering) or hard silver plating (for wear resistance)
Packaging Vacuum-sealed bags + anti-static packaging + outer carton
Customization Diameter (0.02-0.5mm); plating thickness; pre-tinning
Typical Application Scenarios
  • Miniaturized Electronics: Fine-pitch connectors, flexible circuits, and bonding wires for smartphones, wearables, and medical devices.
  • High-Frequency Communication: RF cables, antenna elements, and microwave components requiring low loss and high conductivity.
  • Aerospace & Defense: Lightweight wiring harnesses, sensor leads, and high-frequency signal lines in aircraft and satellite systems.
  • Automotive Electronics: Sensor wires and high-speed data lines in ADAS and infotainment systems.

0.05mm Diameter Silver-Plated Copper Wire With Anti-Oxidation & Corrosion-Proof For Precision Electronics 0